Transient thermal stresses are an important consideration in production processes involving large temperature changes. Recently, thermal stresses have also become significant in design problems related to microelectronic devices through their effects on material properties and system parameters. To calculate the thermal stresses, three kinds of methods are available. The first is the analytical method, in which the elastic theory is used to find the exact solution. The second approach consists of some kind of approximate technique, such as a perturbation procedure.
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