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A scalable and fault-tolerant network routing scheme for many-core and multi-chip systems

机译:用于多核和多芯片系统的可扩展和容错网络路由方案

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摘要

Current on-chip network and inter-chip interconnection are designed separately. However, this traditional design methodology faces a great challenge: in a multi-chip system, each many-core chip contains hundreds or thousands of processors. The increasing number of on-chip processors must share one input/output unit to interface with the inter-chip interconnection. The increased network usage at the chip interface may create an uneven traffic load in the on-chip network. That is, traffic jams could occur in the chip area around the input/output unit. New technologies, such as through silicon via and silicon interposer, can directly connect networks on chips. These technologies can improve communication performance and reduce power consumption by omitting the input/output unit. This paper proposes a novel routing scheme to deal with the network scalability issues related to the many-core and multi-chip system-in-package paradigm. The proposed scheme can also enhance the fault-tolerance of nano-scale communication in deep-submicron designs.
机译:当前的片上网络和片间互连是分开设计的。但是,这种传统的设计方法面临着巨大的挑战:在多芯片系统中,每个多核芯片都包含数百或数千个处理器。越来越多的片上处理器必须共享一个输入/输出单元才能与芯片间互连接口。芯片接口处网络使用率的增加可能会在片上网络中造成不均衡的流量负载。即,在输入/输出单元周围的芯片区域中可能发生交通阻塞。诸如通过硅通孔和硅中介层的新技术可以直接连接芯片上的网络。这些技术可以通过省略输入/输出单元来提高通信性能并降低功耗。本文提出了一种新颖的路由方案,以解决与多核和多芯片封装系统范例有关的网络可扩展性问题。所提出的方案还可以增强深亚微米设计中纳米级通信的容错能力。

著录项

  • 来源
    《Journal of Parallel and Distributed Computing》 |2012年第11期|p.1433-1441|共9页
  • 作者单位

    Information and Communications Research Laboratories,Industrial Technology Research Institute, No. 195, Sec. 4, Chung Hsin Road, Hsinchu 310, Taiwan, ROC;

    Department of Electronic Engineering, Lunghwa University of Science and Technology, Taoyuan 333, Taiwan, ROC;

    Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, Wl 53706-1691, USA;

    Department of Electrical Engineering and Graduate Institute of Electronics Engineering, National Taiwan University, Taipei 106, Taiwan, ROC;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    fault-tolerance; many-core; multi-chip; network routing; scalable system; system-in-package;

    机译:容错多核多芯片网络路由;可扩展系统封装系统;

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