Scalable and energy efficient wireless inter chip interconnection fabrics using THz-band antennas

摘要

Computing platforms ranging from embedded systems to server blades comprise of multiple Systems-on-Chips (SoCs). Conventionally, communication between chips in these multichip platforms are realized using high-speed I/O modules over metal traces on a substrate. Due to the high-power consumption of I/O modules and non-scalable pitch of pins or solder bumps their bandwidth density and power consumption becomes bottleneck for multichip systems. Wireless chip-to-chip communication is emerging as an alternative solution to the traditional interconnection challenges of multichip systems. Novel devices based on graphene structures capable of establishing wireless links are explored in recent literature to provide high bandwidth THz links. In this work, we propose to utilize graphene-based wireless links to enable energy-efficient, multi-modal chip-to-chip communication protocol to create toroidal folding based interconnection architectures for multichip systems. With cycle-accurate simulations we demonstrate that such designs can outperform state-of-the-art wireline multichip systems.