Bond monitoring in temperature dependent applications using Brillouin optical time domain analyser

摘要

Adhesive bond has to be evaluated for its integrity over a range of temperature. Adhesive is being used to bond the sensors with structures. There is no validated technique to test its performance. In this paper, we propose a Brillouin Optical Time Domain Analyzer (BOTDA) based methodology to detect temperature-induced adhesive bond failure below room temperature using distributed fiber optic sensor. The differential coefficient of thermal expansion of the structure and fiber sensor can lead to bond failure at low temperature. Optical fiber impregnated in the structure will experience differential temperature/strain due to debond of the adhesive. This leads to the frequency and amplitude decomposition of the Brillouin spectra. This is a good indication for real-time monitoring of the integrity of a bond.