机译:基于渗透纳米多孔Cu的高功率器件包装低温粘接方法
State Key Lab of Advanced Welding and Joining Harbin Institute of Technology Harbin 150001 China;
Department of Materials Science and Engineering Harbin Institute of Technology Shenzhen 518055 China;
Department of Materials Science and Engineering Harbin Institute of Technology Shenzhen 518055 China;
China Science and Technology On Reliability Physics and Application of Electronic Component Laboratory Guangzhou 510610 China;
Department of Materials Science and Engineering Harbin Institute of Technology Shenzhen 518055 China;
Department of Materials Science and Engineering Harbin Institute of Technology Shenzhen 518055 China;
机译:使用原位表面改性的微型Cu粒子进行低压Cu-Cu键合以用于功率器件包装
机译:使用原位表面改性的微型Cu粒子进行低压Cu-Cu键合以用于功率器件包装
机译:Al-Cu化合物作为大功率器件封装的焊垫的研究
机译:功率器件封装的氧化还原工艺铜冷喷涂沉积铜-铜接头的结合强度
机译:使用Cu-Cu直接键合的3D微电子封装中的热机械问题及其解决方案。
机译:高度可烧结的铜纳米颗粒糊剂的低温低压铜-铜键合
机译:浅谈封装高温功率器件的银烧结加工