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The preparation of ScAlN(002) alloy thin films deposited on Si(100) substrates by DC reactive magnetron sputtering

机译:直流反应磁控溅射沉积在Si(100)衬底上的ScAlN(002)合金薄膜的制备

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摘要

Scandium aluminum nitride (ScAlN) alloy thin films were deposited on (100) silicon substrates by DC reactive magnetron sputtering method using a scandium aluminum alloy (Sc_(0.06)Al_(0.94)) target. The influences of N_2/ Ar-flow ratio, substrate temperature, sputtering power and sputtering pressure on the film's crystal orientation and surface morphology were investigated systematically. The c-axis preferred orientation degree changes obviously, firstly increasing to the maximum and then decreasing, with increasing each of the sputtering parameters. Meanwhile, the surface morphology of ScAIN films performs a similar variation. Then, the relationship between the crystal orientation and piezoelectric response is determined. Finally, it is demonstrated that highly c-axis oriented ScAIN thin films, with FWHM value of the rocking curve of 2.9°, RMS roughness of 2.612 nm and piezoelectric constant d_(33) of 8.9 pC/N, can be obtained with a N_2/Ar-flow ratio of 3.3:7, a substrate temperature of 650 ℃, a sputtering power of 130 W and a sputtering pressure of 0.5 Pa.
机译:使用DC铝合金(Sc_(0.06)Al_(0.94))通过DC反应磁控溅射法在(100)个硅基板上沉积氮化铝铝(ScAlN)合金薄膜。系统地研究了N_2 / Ar流量比,衬底温度,溅射功率和溅射压力对薄膜晶体取向和表面形貌的影响。随着每个溅射参数的增加,c轴优选取向度明显变化,首先增加到最大值,然后减小。同时,ScAIN膜的表面形态表现出相似的变化。然后,确定晶体取向与压电响应之间的关系。最后,证明了使用N_2可以得到高度c轴取向的ScAIN薄膜,其FWHM值的摇摆曲线为2.9°,RMS粗糙度为2.612 nm,压电常数d_(33)为8.9 pC / N。 / Ar流量比为3.3:7,基板温度为650℃,溅射功率为130 W,溅射压力为0.5 Pa。

著录项

  • 来源
    《Journal of materials science》 |2015年第4期|2151-2160|共10页
  • 作者单位

    State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China;

    State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China;

    State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China;

    State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China;

    State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

  • 入库时间 2022-08-17 13:45:18

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