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Understanding noninvasive charge transfer doping of graphene: a comparative study

机译:了解石墨烯的无创电荷转移掺杂:一项比较研究

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Abstract In this work, we systematically investigate and compare noninvasive doping of chemical vapor deposition graphene with three molecule dopants through spectroscopy and electrical conductivity techniques. Thionyl chloride shows the smallest improvement in conductivity with poor temporal and thermal stability and nitric acid induces the biggest sheet resistance reduction with modified stability. Molybdenum trioxide doping stands out, after thermal annealing, with both causing a significant sheet-resistance reduction and having superior temporal and thermal stability. These properties make it ideal for applications in advanced electronics. Theoretical studies based on the van der Waals density functional method suggest that cluster formation of molybdenum trioxide underpins the significant reduction in sheet resistance, and the stability, that arises after thermal annealing. Our comparative study clarifies charge transfer doping of graphene and brings understanding of the weak-interaction nature of such non-destructive doping of graphene. Our work also shows that we can use weak chemisorption to tailor the electronic properties of graphene, for example, to improve conductivity. This ability open up possibilities for further use of graphene in electronic interconnects, field effect transistors and other systems.
机译:摘要在这项工作中,我们通过光谱学和电导率技术系统地研究和比较了化学气相沉积石墨烯与三分子掺杂剂的无创掺杂。亚硫酰氯在最小的时间和热稳定性方面显示出最小的电导率提高,而硝酸则在具有改进的稳定性的情况下最大程度地降低了薄层电阻。在热退火之后,三氧化钼掺杂非常引人注目,既引起显着的薄层电阻降低,又具有优异的时间和热稳定性。这些特性使其非常适合高级电子设备中的应用。基于Van der Waals密度泛函方法的理论研究表明,三氧化钼的团簇形成支撑了热退火后薄层电阻和稳定性的显着降低。我们的比较研究阐明了石墨烯的电荷转移掺杂,并带来了对这种无损掺杂石墨烯的弱相互作用性质的理解。我们的工作还表明,我们可以使用弱化学吸附来调整石墨烯的电子性能,例如,以提高电导率。这种能力为在电子互连,场效应晶体管和其他系统中进一步使用石墨烯开辟了可能性。

著录项

  • 来源
    《Journal of materials science》 |2018年第7期|5239-5252|共14页
  • 作者单位

    Electronics Materials and Systems Laboratory, Department of Microtechnology and Nanoscience (MC2), Chalmers University of Technology;

    Electronics Materials and Systems Laboratory, Department of Microtechnology and Nanoscience (MC2), Chalmers University of Technology,SMIT Center and School of Mechatronics and Mechanical Engineering, Shanghai University,Fingerprint Cards AB;

    Electronics Materials and Systems Laboratory, Department of Microtechnology and Nanoscience (MC2), Chalmers University of Technology,SHT Smart High-Tech AB;

    Electronics Materials and Systems Laboratory, Department of Microtechnology and Nanoscience (MC2), Chalmers University of Technology;

    Electronics Materials and Systems Laboratory, Department of Microtechnology and Nanoscience (MC2), Chalmers University of Technology;

    Electronics Materials and Systems Laboratory, Department of Microtechnology and Nanoscience (MC2), Chalmers University of Technology;

    Electronics Materials and Systems Laboratory, Department of Microtechnology and Nanoscience (MC2), Chalmers University of Technology,SMIT Center and School of Mechatronics and Mechanical Engineering, Shanghai University;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
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  • 入库时间 2022-08-17 13:43:32

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