AbstractMicron level Cu-pillar microbumps, which appear as the size of three-dimensional packaging shrinks down, have to '/> Investigation of intermetallic compound and voids growth in fine- pitch Sn-3.5Ag/Ni/Cu microbumps
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Investigation of intermetallic compound and voids growth in fine- pitch Sn-3.5Ag/Ni/Cu microbumps

机译:细间距Sn-3.5Ag / Ni / Cu微凸块中金属间化合物的研究和空隙的生长

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摘要

AbstractMicron level Cu-pillar microbumps, which appear as the size of three-dimensional packaging shrinks down, have to introduce many unexpected reliability problems. The fast growth of intermetallic compounds (IMC) and voids tend to be a serious one. In this paper, the growth behaviors of IMC and voids were investigated in Sn–3.5Ag/Ni/Cu bumps, which were in the diameter ranging from 6 to 11 μm and fabricated under same reflow process. The consequence manifested that the growth rate of interfacial IMC increased from 0.448 to 0.578 μm/min as the bump diameter decreased from 11 to 6 μm and the acquired IMC could be divided into two layers: the (Cu, Ni)6Sn5layer and Ni3Sn4layer. As a result of the migration of Ni atoms, many voids were left in the interface between (Cu, Ni)6Sn5and Ni3Sn4. In the edge of Cu pillar, side wall wetting reaction was detected, which was confirmed by the formation of voids and (Cu, Ni)6Sn5phase. Further, as the bump diameter decreased, the side wall wetting reaction aggravated, which partly contributed to the acceleration of IMC growth.
机译: 摘要 微米级的铜柱微凸点,随着三维包装尺寸的缩小而出现引入许多意外的可靠性问题。金属间化合物(IMC)和空隙的快速增长往往是一个严重的问题。在本文中,研究了IMC和空洞在Sn–3.5Ag / Ni / Cu凸块中的生长行为,该凸块的直径范围为6至11μm,并且是在相同的回流工艺下制造的。结果表明,随着凸块直径从11μm减小到6μm,界面IMC的生长速率从0.448增加到0.578μm/ min,获得的IMC可以分为两层:(Cu,Ni)<下标> 6 < / Subscript> Sn 5 层和Ni 3 Sn 4 层。由于Ni原子的迁移,在(Cu,Ni) 6 Sn 5 和Ni 3 之间的界面中留有许多空隙Sn 4 。在Cu柱的边缘,检测到侧壁润湿反应,这通过形成空隙和(Cu,Ni) 6 Sn 5 相来证实。此外,随着凸块直径的减小,侧壁的润湿反应加剧,这部分促进了IMC的生长。

著录项

  • 来源
    《Journal of materials science》 |2018年第3期|1861-1867|共7页
  • 作者单位

    State Key Lab Of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University;

    State Key Lab Of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University;

    State Key Lab Of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University;

    State Key Lab Of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University;

    State Key Lab Of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University;

    State Key Lab Of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University;

    Institute of Microelectronic of Chinese Academy of Sciences;

    Institute of Microelectronic of Chinese Academy of Sciences;

    Institute of Microelectronic of Chinese Academy of Sciences;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
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  • 入库时间 2022-08-17 13:43:19

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