机译:细间距Sn-3.5Ag / Ni / Cu微凸块中金属间化合物的研究和空隙的生长
State Key Lab Of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University;
State Key Lab Of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University;
State Key Lab Of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University;
State Key Lab Of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University;
State Key Lab Of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University;
State Key Lab Of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University;
Institute of Microelectronic of Chinese Academy of Sciences;
Institute of Microelectronic of Chinese Academy of Sciences;
Institute of Microelectronic of Chinese Academy of Sciences;
机译:温度和电流应力对Cu柱/Sn-3.5Ag微凸点金属间化合物生长特性的影响
机译:Cu-Sn金属间化合物反应对Cu / Sn / Cu微凸块中Kirkendall空隙生长特性的影响
机译:Sn晶粒取向对Cu-Sn2.3Ag-Ni微凸块热迁移过程中Cu-Sn金属间化合物生长的影响
机译:等温老化下10μmCu / Sn和Cu / Ni / Sn微凸块中金属间化合物生长的研究
机译:用于3D-IC包装的微型凸点中多孔Cu3Sn金属间化合物的形成机理
机译:固态时效期间Sn-3.0Ag-0.5Cu焊料与FeCoNiCrCu0.5衬底之间的界面处(FeCrCoNiCu)Sn2金属间化合物的生长受到抑制
机译:sn-Cu-Ni无铅钎料中金属间化合物的研究