AbstractMonoclinic Fabrication of Cu_2SnS_3 films by annealing chemically deposited SnS-CuS precursors in a graphite box
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Fabrication of Cu_2SnS_3 films by annealing chemically deposited SnS-CuS precursors in a graphite box

机译:通过在石墨箱中对化学沉积的SnS-CuS前体进行退火来制备Cu_2SnS_3膜

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AbstractMonoclinic$$text {Cu}_{2}text {SnS}_{3}$$Cu2SnS3(CTS) thin films are prepared by annealing chemically deposited SnS–CuS precursors at 520-580$$^{circ }text {C}$$Cin a graphite box under atmospheric ($$text {N}_{2}+text {S}_{2}$$N2+S2) pressure, and the effects of annealing temperature and time on the grain growth and morphology of the films are investigated. The films prepared at 520 and 550$$^{circ }{text{C }}$$Cshow improvement in grain size and the formation of uniform and compact grains with increasing annealing time. The films prepared at 580$$^{circ }text {C}$$Cexhibit good grain growth with grain sizes$$sim 1.0{-}3.0,upmu text {m}$$1.0-3.0μm; however, the grain size does not increase with annealing time. Further, annealing time of 120 min at 550 and 580$$^{circ }text {C}$$Cleads to material loss. A small amount of$$text {Cu}_{4}text {SnS}_{4}$$Cu4SnS4is detected in the films. In addition, annealing the films at 550 and 580$$^{circ }text {C}$$Cfor 90 min with decreased CuS thickness results in a reduction of$$text {Cu}_{4}text {SnS}_{4}$$Cu4SnS4phase, homogeneous grain growth with grain sizes of$$2.0{-}3.5,upmu text {m}$$2.0-3.5μmthroughout the film thickness, and hole mobilities in the range of$$6.0{-}5.3,text {cm}^{2},text {V}^{-1},text {s}^{-1}$$6.0-5.3cm2V-1s-1. These results demonstrate the effectiveness of this annealing approach for producing high quality CTS films with micron-sized grains, which is useful for improving the efficiency of CTS-based thin film solar cells.
机译: Abstract Monoclinic $$ text {Cu} _ {2} text {SnS} _ {3} $$ <数学xmlns:xlink =“ http://www.w3.org/1999/xlink”> < mtext> Cu 2 SnS 3 (CTS)薄膜是通过在520-580 $$ ^ {circ}文本{C} $$ <数学xmlns:xlink =“ http://www.w3.org / 1999 / xlink“> C 在大气中的石墨箱中( $$ text {N} _ {2} + text {S} _ {2} $$ N 2 + S 2 )压力以及退火温度的影响研究了时间对薄膜生长和形貌的影响。在520和550处准备的电影 < / InlineMediaObject> $$ ^ {circ} {text {C}} $$ <数学xmlns:xlink =“ http:// www。 w3.org/1999/xlink">C 随着退火时间的增加,晶粒尺寸有所改善,并且形成了均匀而致密的晶粒。在580 $$ ^ {circ}文本{C} $$ <数学xmlns:xlink =“ http://www.w3.org/ 1999 / xlink“> C 以晶粒尺寸表现出良好的晶粒生长 $$ sim 1.0 {-} 3.0,upmu文本{m} $$ <数学xmlns:xlink =“ http:/ /www.w3.org/1999/xlink">~1.0-3.0 μ m ;但是,晶粒尺寸不会随着退火时间而增加。此外,在550和580处120分钟的退火时间 $$ ^ {circ}文本{C} $$ <数学xmlns:xlink =” http:// www.w3.org/1999/xlink“> C < / EquationSource> 导致物质损失。少量的 $$ text {Cu} _ {4} text {SnS} _ {4} $$ <数学xmlns:xlink =“ http:/ /www.w3.org/1999/xlink“> Cu 4 SnS <影片中检测到mn> 4 。此外,在550和580退火薄膜。 $$ ^ {circ}文本{C} $$ <数学xmlns:xlink =“ http://www.w3 .org / 1999 / xlink“> C 90分钟且CuS厚度减小,导致 $$ text {Cu} _ {4} text {SnS} _ {4} $$ <数学xmlns:xlink =” http://www.w3.org/1999/xlink“> Cu 4 SnS 4 相位均匀的晶粒生长,晶粒尺寸为 $$ 2.0 {-} 3.5,upmu文本{m} $$ <数学xmlns:xlink =“ http://www.w3.org/1999/xlink”> 2.0 - 3.5 μ m 在整个膜厚和孔迁移率中 < EquationSource格式=“ TEX”> $$ 6.0 {-} 5.3,文本{cm} ^ {2},文本{V} ^ {-1},文本{s} ^ {-1} $$ <数学xmlns:xlink =“ http://www.w3.org /1999/xlink">6.0-5.3 cm 2 V - 1 s - 1 。这些结果证明了这种退火方法对于生产具有微米级晶粒的高质量CTS膜的有效性,这对于提高CTS基薄膜太阳能电池的效率是有用的。

著录项

  • 来源
    《Journal of materials science》 |2018年第2期|1451-1462|共12页
  • 作者单位

    Department of Electronic Engineering, Yeungnam University;

    Department of Electronic Engineering, Yeungnam University;

    Department of Electronic Engineering, Yeungnam University;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
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  • 入库时间 2022-08-17 13:43:26

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