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Quantitative adhesion measures of multilayer films: Part I. Indentation mechanics

机译:多层膜的定量粘合措施:第一部分:压痕力学

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The mechanics for calculating the quantitative driving force of indentation-induced delamination of thin-film multilayers is presented. The solution is based on the mechanics developed by Marshall and Evans [D.B. Marshall and A.G. Evans, J. Appl. Phys. 56, 2632 (l984).] and extended to the general case of a multilayer by use of standard bending and thin-plate analyses. Presented and discussed are the specific solutions for the bilayer case that show that in the limit of zero thickness of either layer, the solution converges to the single-layer case. In the range of finite thickness, the presence of the superlayer increases the driving force relative to that possible for the original film alone and can be optimized to the experimental situation by proper choice of thickness, elastic constants, and residual stress. The companion paper "Quantitative adhesion measures of multilayer films; Part II. Indentation of W/Cu, W, Ctw" discusses experimental results with copper, tungsten, and chromium thin films.
机译:介绍了用于计算薄膜多层压痕诱发分层的定量驱动力的机制。该解决方案基于Marshall和Evans [D.B. Marshall和A.G. Evans,J。Appl。物理参见美国专利56,2632(1984)。]并通过使用标准弯曲和薄板分析扩展到多层的一般情况。提出并讨论的是双层情况的具体解决方案,这些解决方案表明在任一层的零厚度限制内,该解决方案都收敛到单层情况。在有限的厚度范围内,相对于单独的原始膜,上层的存在会增加驱动力,并且可以通过适当选择厚度,弹性常数和残余应力来优化实验条件。随附的论文“多层膜的定量粘合措施;第二部分:W / Cu,W,Ctw的压痕”讨论了铜,钨和铬薄膜的实验结果。

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