A novel structured spiral planar embedded inductor: Electroless-plating NiCoP alloy on copper coil as magnetic core

摘要

In this work, electroless-plating of magnetic film directly on planar spiral copper coil to fabricate embedded inductor was designed and realized by introducing NiCoP alloys as its cladding magnetic core. This method with novel structure was achieved with significant increasing of inductance L and Q factor. The optimized alloy of Ni41Co58P1 results in enhanced inductance L around 32%@10 MHz and Q factor of 18. Cp experimental demonstrates its typical ignorable parasitic capacitance. Finally, HFSS simulation revealed the magnetic film constrained the magnetic line transmitted flowing the magnetic film, leading to effective inductance L increasing, which is in good agree with the experimental results.