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Comparison of the electromechanical properties of embedded and surface-mounted piezoelectric transducers

机译:嵌入式和表面安装式压电换能器的机电性能比较

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An experimental and computational comparison of the structural and electromechanical coupling properties of composite beams with surface-mounted and embedded piezoelectric disks shows that the embedded sensors tend to have higher electromechanical coupling coefficients due to improved strain transfer between the transducer and host material. Experimental testing of fiber-epoxy composite beams with embedded and surface-mounted piezoelectric disks under quasi-static three-point bending tests shows that bending elastic moduli and ultimate stresses are not significantly different between these two cases, while ultimate strains are greater for the surface-mounted cases compared with the embedded cases. Electromechanical coupling decreases with increasing bending loads due to either debonding between the sensor and host structure or due to damage of the brittle piezoelectric material. Embedded sensors tend to show a smaller degradation in electromechanical coupling with increasing stress level.
机译:对表面安装和嵌入式压电盘的复合梁的结构和机电耦合特性的实验和计算比较表明,由于传感器和主体材料之间的应变传递得到了改善,因此嵌入式传感器往往具有较高的机电耦合系数。具有嵌入式和表面安装压电盘的纤维环氧复合梁在准静态三点弯曲试验下的实验测试表明,这两种情况下的弯曲弹性模量和极限应力没有显着差异,而表面的极限应变更大嵌入式机箱与嵌入式机箱比较。机电耦合随着弯曲载荷的增加而减小,这归因于传感器和主机结构之间的脱粘或由于脆性压电材料的损坏。嵌入式传感器往往会随着应力水平的提高而在机电耦合中表现出较小的退化。

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