Patent Issued for Circuit Board Having Pad and Chip Package Structure

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Patent Issued for Circuit Board Having Pad and Chip Package Structure

机译：具有焊盘和芯片封装结构的电路板已获得专利

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2013 MAR 20 (VerticalNews) -- By a News Reporter-Staff News Editor at Journal of Engineering --nAdvanced Semiconductor Engineering, Inc. (Kaohsiung, TW) has been issued patent number 8389869,naccording to news reporting originating out of Alexandria, Virginia, by VerticalNews editors.

机译：2013年3月20日（垂直新闻）-由《工程杂志》的新闻记者-工作人员新闻编辑-根据位于弗吉尼亚州亚历山大市的新闻报道，nAdvanced Semiconductor Engineering，Inc.（TW.Kaohsiung）已获得专利号8389869。，由VerticalNews编辑。

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《Journal of Engineering》 |2013年第12期|1-3|共3页
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正文语种 eng
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Electronics; Circuit Board; Advanced Semiconductor Engineering Inc..;

机译：电子产品;电路板;先进半导体工程公司;

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专利

1. Patent Issued for Pad Layout Structure of Semiconductor Chip [J] . Journal of Engineering . 2013,第12期

机译：半导体芯片的焊盘布局结构专利
2. Patent Issued for High-Speed Transmission Circuit Board Connection Structure [J] . Journal of Engineering . 2013,第13期

机译：高速传输电路板连接结构专利
3. Advanced HiCTE Flip Chip Packaging of 90-nm Cu/Low-K Chips:Underfill,Novel Terminal Pad Structures,and Processing Optimization [J] . SURASIT CHUNGPAIBOONPATANA, FRANK G.SHI Journal of Electronic Materials . 2005,第7期

机译：90nm Cu / Low-K芯片的高级HiCTE倒装芯片封装：底部填充，新颖的端子焊盘结构和工艺优化
4. Wire-bonding on inkjet-printed silver pads reinforced by electroless plating for chip on flexible board packages [C] . 3rd Electronic System-Integration Technology Conference . 2010

机译：通过化学镀加固的喷墨印刷银焊盘上的引线键合，用于柔性板封装上的芯片
5. Computational Analysis of Impact Loading on Wafer Level Chip Scale Packages Mounted on Printed Circuit Boards of Varying Thickness. [D] . Mahmood, Anik. 2016

机译：对安装在厚度不同的印刷电路板上的晶圆级芯片级封装的冲击载荷的计算分析。
6. Flexible packaging of solid-state integrated circuit chips with elastomeric microfluidics [O] . Bowei Zhang, Quan Dong, Can E. Korman, -1

机译：带有弹性微流体的固态集成电路芯片的软包装
7. Wire-Bonding on Inkjet-Printed Silver Pads Reinforced by Electroless Plating for Chip on Flexible Board Packages [O] . Romain Cauchois, Mohamed Saadaoui, Jacques Legeleux, 2013

机译：通过化学镀制增强喷墨印刷银焊盘上的线焊，用于柔性板封装上的芯片
8. Apparatus and methods for packaging integrated circuit chips with antenna modules providing closed electromagnetic environment for integrated antennas [R] . 2008

机译：用于封装集成电路芯片的装置和方法，其中天线模块为集成天线提供闭合电磁环境

Patent Issued for Circuit Board Having Pad and Chip Package Structure

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