Researchers Submit Patent Application, 'Internally Cooled, Thermally Closed Modular Laser Package System', for Approval

摘要

2013 MAR 20 (VerticalNews) -- By a News Reporter-Staff News Editor at Journal of Engineering -- From Washington, D.C., VerticalNews journalists report that a patent application by the inventors Chen, Pei Chuang (Monrovia, CA); Wang, Leming (Monrovia, CA); Luo, Xin Simon (Monrovia, CA), filed on August 25, 2011, was cleared for further review on March 7, 2013.