Asian Vendors, Visitors Flock to See Latest in Production at Internepcon

摘要

Internepcon World Japan 2004, Asia's largest exhibit of electronics manufacturing, packaging and inspection technology featured six exhibitions that were held at the same time, including the 33rd Internepcon Japan. At the event, 903 companies exhibited the latest technologies and products from 1,995 booths at Tokyo Big Sight international convention center in Ariake from January 28-30. The exposition also included special seminars and technical displays for companies exhibiting in the event. Exhibitors showcased extensive product lineups at the show, which outstripped last year's. The exposition, which encompasses all facets of technology ranging from upstream to downstream electronics packaging, attracted more than 50,000 visitors. The Internepcon World Japan consisted of six exhibitions: 33rd Internepcon Japan, the 21st Electrotest Japan, the 5th IC Packaging Technology Expo, the 5th Printed Wiring Boards Expo, the 5th Electronic Components Expo and the 4th Fiber Optics Expo. The organizer, Reed Exhibitions Japan Ltd., boasted that the exposition was the largest technical exhibition of electronics manufacturing, packaging and inspection technology and equipment in Asia.