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首页> 外文期刊>Journal of the electronics industry >Makers' New Chipsets Designed To Step Up Adoption of 3G Services
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Makers' New Chipsets Designed To Step Up Adoption of 3G Services

机译:制造商的新芯片组旨在加快3G服务的采用

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摘要

International shows are a perfect venue for manufacturers to introduce their latest offerings. At the November 2004 3G World Congress and Exhibition in Hong Kong, companies such as Analog Devices Inc. (ADI), Qualcomm Inc., Texas Instruments Inc. (TI), and Infineon Technologies AG presented their newest lines of chipsets that support third generation (3G) services.
机译:国际展览会是制造商介绍其最新产品的理想场所。在2004年11月于香港举行的3G世界大会暨展览会上,诸如Analog Devices Inc.(ADI),Qualcomm Inc.,Texas Instruments Inc.(TI)和Infineon Technologies AG等公司展示了它们最新的支持第三代芯片组产品线(3G)服务。

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