Editorial

摘要

InterPACK is the premier international forum for the exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronic packaging, MEMS, and NEMS. It is the flagship conference of the ASME Electronic and Photonic Packaging Division. InterPACK 2013 had an outstanding technical program featuring more than 200 technical presentations in 47 technical sessions. These sessions were organized by nine Technical Track Committees comprised of leading researchers and engineers from industrial companies, government laboratories, and academic institutions throughout the world. The nine tracks are: (1) advanced packaging, (2) electrical, (3) emerging technologies, (4) modeling and simulation, (5) multiphysics based reliability, (6) MEMS and NEMS, (7) materials and processes, (8) thermal management, and (9) data centers and energy efficient electronic systems. At the end of the conference, each track chair was invited to recommend two papers from their track for this special section. All the recommended papers are again reviewed and some of them are selected for publication in this special section.