This symposium will address the materials and manufacturing aspects of alloy design of lead-tin and lead-free solders, structure-property-processing relation- ships of bulk solders as well as solder joints, influence of underbump metalliza- tion on solderability and reliability of solder joints, microstructure modeling and control, reliability modeling and testing methodologies of electronic packages. The symposium will also cover the materials for metal-semiconductor contacts, alternative interconnect technology for stress management at both wafer-level and chip to package level, and the issues involved in the design and integration of conductive adhesives in electronic packages. Topics related to soldering in optoelectronic and microelectronic packages, such as BGA, micro-BGA, chip- scale, etc. are also of special interest. Abstracts are due by July 15, 1999, at www.tms.org/cms.
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