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Melt Processing for Strong Flux Pinning in RE-Ba-Cu-O (RE: Nd, Sm, Eu, Gd) Superconductors

机译:RE-Ba-Cu-O(RE:Nd,Sm,Eu,Gd)超导体中强通量钉扎的熔融工艺

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摘要

Factors affecting a characteristic flux pinning in light rare earth (RE)-Ba-Cu-O (RE: Nd, Sm, Eu, Gd) superconductors fabricated by the oxygen-controlled-melt-growth (OCMG) process have been investigated through a comparative study. At 77K and for the applied field parallel to the c-axis of the sample (H//c), the flux pinning of all OCMG-processed REBa_2Cu_3O_y (RE 123) samples studied was very sensitive to the oxygen partial pressure (P_(O2)) controlled during the melt growth and thus, with lowering P_(O2), the peak field (B_(pk)) in the M-H loops shifted to a high field and the irreversibility line (IL) shifted to a high H-T region. For a Ndl23 sample, as the oxygen annealing temperature increased above 300℃, both B_(pk) and IL were systematically depressed. However, B_(pk) for all systems was insensitive to the amount of the second phase (Nd_4Ba_2Cu_2O_(10) (Nd422) and RE_2BaCuO_5 (RE211) for the other) inclusion in the superconducting RE 123 matrix, supporting that the characteristic flux pinning is due to the superconducting matrix.
机译:通过氧控制熔体生长(OCMG)工艺研究了影响通过光控制熔体生长(OCMG)工艺制造的轻稀土(RE)-Ba-Cu-O(RE:Nd,Sm,Eu,Gd)超导体的特征通量钉扎的因素。比较研究。在77K且对于平行于样品c轴的施加场(H // c),所有研究的OCMG处理的REBa_2Cu_3O_y(RE 123)样品的通量钉扎对氧分压(P_(O2 ))在熔体生长过程中受到控制,因此,随着P_(O2)的降低,MH回路中的峰场(B_(pk))移至高电场,而不可逆线(IL)移至高HT区。对于Ndl23样品,随着氧气退火温度升高至300℃以上,B_(pk)和IL均被系统降低。但是,所有系统的B_(pk)对第二相(Nd_4Ba_2Cu_2O_(10)(Nd422)和RE_2BaCuO_5(RE211)的另一相)的数量不敏感,这些元素包含在超导RE 123矩阵中,支持特征通量钉扎是由于超导矩阵。

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