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Defect Structures in Silicon Merged Epitaxial Lateral Overgrowth

机译:硅合并外延横向过度生长中的缺陷结构

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摘要

Merging of two epitaxial lateral overgrowth fronts has been achieved to produce thin silicon-on-insulator (SOI) structures. The electronic quality of the material is generally of high quality; however, at the merger interface are defects associated with improper merging. Defects at the oxide/silicon interface and the merging interface were characterized using transmission electron microscopy. Device performance indicated the need for a process modification to improve the material quality for potential electronic applications.
机译:已实现两个外延横向过度生长前沿的合并,以生产绝缘体上薄硅(SOI)结构。材料的电子质量通常是高质量的;但是,在合并界面处存在与合并不当相关的缺陷。使用透射电子显微镜表征了氧化物/硅界面和合并界面的缺陷。器件性能表明需要进行工艺修改以提高潜在电子应用的材料质量。

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