The thermal conductivities of a typical isotropic conductive adhesive (ICA) composed of an epoxy-based binder containing flake-shaped and spherical Ag particles have been studied. The ICA specimens exhibit anisotropy in their thermal conductivities between the vertical and in-plane directions. In addition, their thermal conductivities apparently depend on their thermal history during the curing and subsequent annealing processes, even if they are fully cured during the preliminary curing stage. The thermal conductivities tend to increase with decreasing electrical resistivities. The experimental values for the thermal conductivities of the ICA specimens were apparently higher than␣those predicted using Bruggemann’s equation. Analysis using the Wiedemann–Franz (W–F) law indicates that their thermal conductivities increase with increasing contribution from electrical conduction. In order to discuss the thermal conductivities of ICA specimens that exhibit relatively low electrical resistivities (below 10−3 Ω cm), the contribution of the conducting electrons must be included.
展开▼