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Physical Factors Determining Thermal Conductivities of Isotropic Conductive Adhesives

机译:确定各向同性导电胶的导热系数的物理因素

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The thermal conductivities of a typical isotropic conductive adhesive (ICA) composed of an epoxy-based binder containing flake-shaped and spherical Ag particles have been studied. The ICA specimens exhibit anisotropy in their thermal conductivities between the vertical and in-plane directions. In addition, their thermal conductivities apparently depend on their thermal history during the curing and subsequent annealing processes, even if they are fully cured during the preliminary curing stage. The thermal conductivities tend to increase with decreasing electrical resistivities. The experimental values for the thermal conductivities of the ICA specimens were apparently higher than␣those predicted using Bruggemann’s equation. Analysis using the Wiedemann–Franz (W–F) law indicates that their thermal conductivities increase with increasing contribution from electrical conduction. In order to discuss the thermal conductivities of ICA specimens that exhibit relatively low electrical resistivities (below 10−3 Ω cm), the contribution of the conducting electrons must be included.
机译:已经研究了典型的各向同性导电粘合剂(ICA)的导热性,该粘合剂由包含片状和球形Ag颗粒的环氧基粘合剂组成。 ICA样品在垂直方向和平面方向之间的热导率表现出各向异性。另外,即使它们在初步固化阶段已完全固化,它们的热导率显然也取决于它们在固化和随后的退火过程中的热历史。导热率倾向于随着电阻率的降低而增加。 ICA样品的热导率实验值显然高于使用Bruggemann方程预测的值。使用维德曼-弗朗兹(WF)律的分析表明,它们的热导率随着电导率的增加而增加。为了讨论具有相对低电阻率(低于10 -3 Ωcm)的ICA样品的热导率,必须包括导电电子的贡献。

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