Erratum to: A Cryo-XPS Study of Triammonium Citrate-KAuCl4-Na2SO3 Electroplating Solutions for Pb-Free Solder Packaging

Neda Dalili; Anqiang He; Qi Liu; Douglas G. Ivey

首页> 外文期刊>Journal of Electronic Materials >Erratum to: A Cryo-XPS Study of Triammonium Citrate-KAuCl₄-Na₂SO₃ Electroplating Solutions for Pb-Free Solder Packaging

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Erratum to: A Cryo-XPS Study of Triammonium Citrate-KAuCl₄-Na₂SO₃ Electroplating Solutions for Pb-Free Solder Packaging

机译：勘误：柠檬酸三铵-KAuCl _{4 -Na _{2 SO _{3 无铅焊料包装电镀液的Cryo-XPS研究}}}

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来源
《Journal of Electronic Materials》 |2010年第12期|p.1-1|共1页
作者
Neda Dalili; Anqiang He; Qi Liu; Douglas G. Ivey;
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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
原文格式 PDF
正文语种 eng
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入库时间 2022-08-18 00:04:49

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1. A Cryo-XPS Study of Triammonium Citrate-KAuCl₄-Na₂SO₃ Electroplating Solutions for Pb-Free Solder Packaging [J] . Neda Dalili, Anqiang He, Qi Liu, Journal of Electronic Materials . 2010,第9期

机译：无铅焊料包装中柠檬酸三铵-KAuCl _{4 -Na _{2 SO _{3 电镀溶液的Cryo-XPS研究}}}
2. A Cryo-XPS Study of Triammonium Citrate-KAuCl_(4)-Na_(2)SO_(3) Electroplating Solutions for Pb-Free Solder Packaging [J] . NEDA DALILI, ANQIANG HE, QI LIU, Journal of Electronic Materials . 2010,第9期

机译：无铅焊料包装的柠檬酸三铵-KAuCl_（4）-Na_（2）SO_（3）电镀溶液的Cryo-XPS研究
3. Pb-free solder bumping for flip chip package by electroplating [J] . Hyeon Hwang, Soon-Min Hong, Jae-Pil Jung, Soldering & Surface Mount Technology . 2003,第2期

机译：电镀倒装芯片封装的无铅焊料凸点
4. NEW GENERATION OF Pb-FREE SOLDER ALLOYS: POSSIBLE SOLUTION TO SOLVE CURRENT ISSUES WITH MAIN STREAM Pb-FREE SOLDERING [C] . Polina Snugovsky, Simin Bagheri, Marianne Romansky, International Conference on Soldering and Reliability . 2013

机译：新一代无铅焊料合金：可能解决主流无铅焊接当前问题的解决方案
5. Synthesis, Formulation, and Reliability Study of Novel Pb-Free Nanocomposite Solder Pastes for Electronics Assembly and Packaging [D] . Wernicki, Evan . 2020

机译：用于电子组装和包装的新型PB无铅纳米复合材料焊膏的合成，制剂和可靠性研究
6. Erratum to: ‘Perioperative use of crystalloids in patients undergoing open radical cystectomy: balanced Ringer’s maleate versus a glucose 5 /potassium-based balanced solution: study protocol for a randomized controlled trial’ [O] . Lukas M. Löffel, Bettina Kleeb, Fiona C. Burkhard, 2016

机译：勘误至：在接受彻底根治性膀胱切除术的患者中围手术期使用晶体：平衡的林格氏马来酸盐与葡萄糖的5％/钾基平衡溶液：一项随机对照试验的研究方案
7. Properties of Electroplated Sn-Ag Alloy Films as Pb-Free Solderable Coating Obtained by Composite Plating. [O] . Yutaka FUJIWARA, Toshimitsu NAGAO, Hidehiko ENOMOTO, 2002

机译：电镀Sn-Ag合金膜的性能作为通过复合电镀获得的无铅可焊接涂层。

Erratum to: A Cryo-XPS Study of Triammonium Citrate-KAuCl4-Na2SO3 Electroplating Solutions for Pb-Free Solder Packaging

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Erratum to: A Cryo-XPS Study of Triammonium Citrate-KAuCl₄-Na₂SO₃ Electroplating Solutions for Pb-Free Solder Packaging