Recrystallization of Electrodeposited Copper Thin Films During Annealing

摘要

The microstructure evolution of electrodeposited copper thin films was studied at room and elevated temperatures. The effects of isothermal and nonisothermal treatments were investigated. The heating rate in nonisothermal treatment was found to significantly control the recrystallization temperature and time. The Johnson–Mehl–Avrami–Kolmogorov model was applied to describe the fraction recrystallized under isothermal conditions. It was proven that the recrystallization of copper films during nonisothermal annealing can be modeled using the additivity rule. Based on the isothermal results, a model was applied to predict the recrystallization kinetics during nonisothermal heat treatments.