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In-situ Etching Of Gaas/al_xga(1-x)as By Cbr_4

机译:Gabr / al_xga(1-x)的原位蚀刻Cbr_4

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In-situ etching of GaAs and Al_xGa(1-x)As in LP-MOVPE has been studied using carbon tetrabromide (CBr_4). This source is routinely used by us as a source for carbon doping in GaAs and AlGaAs. The etching rate decreases with increasing AsH_3 partial pressure. While the etch rate is nearly constant for GaAs between 600 and 700 ℃ it strongly drops towards higher temperatures with higher Al content in the layers. A model based on blocking of the surface by non-volatile Al-Br compounds is proposed. The observed effects allow for selective in-situ etching of GaAs against AlGaAs.
机译:使用四溴化碳(CBr_4)研究了LP-MOVPE中GaAs和Al_xGa(1-x)As的原位蚀刻。我们通常将此来源用作GaAs和AlGaAs中碳掺杂的来源。蚀刻速率随着AsH_3分压的增加而降低。尽管在600到700℃之间,GaAs的腐蚀速率几乎恒定,但随着层中Al含量的增加,向较高温度的腐蚀速率会大大下降。提出了一种基于非挥发性Al-Br化合物阻断表面的模型。观察到的效果允许针对AlGaAs选择性地原位蚀刻GaAs。

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