机译:电子设备的并行多尺度仿真
Dept. of Electronic Engineering, University of Rome 'Tor Vergata', 00133 Rome, Italy;
Dept. of Electronic Engineering, University of Rome 'Tor Vergata', 00133 Rome, Italy;
Dept. of Electronic Engineering, University of Rome 'Tor Vergata', 00133 Rome, Italy;
Dept. of Electronic Engineering, University of Rome 'Tor Vergata', 00133 Rome, Italy;
Dept. of Electronic Engineering, University of Rome 'Tor Vergata', 00133 Rome, Italy,Purdue University, West Lafayette, USA;
Dept. of Electronic Engineering, University of Rome 'Tor Vergata', 00133 Rome, Italy;
Dept. of Electronic Engineering, University of Rome 'Tor Vergata', 00133 Rome, Italy;
multiscale; quantum; atomistic; tight binding; drift-diffusion; selfconsistent;
机译:电子设备的多尺度量子力学/电磁学仿真
机译:分子电子学的多尺度仿真技术:定向自组装分子n位移位寄存器存储器件的设计
机译:电子设备仿真中的多尺度范例
机译:电子密度官能,分子动力学和粗粒子动力学和粗颗粒的多尺度模拟的同时耦合,用于纳米结构材料的多尺度模拟
机译:现实的纳米级设备的电子特性的预测性原子模拟:一种多尺度建模方法。
机译:建模和电子结构材料界面和随机掺杂的仿真在纳米电子器件
机译:用TiberCaD实现电子和光电器件的多尺度仿真