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Effects of different interlayers on indium-tin oxide thin films sputtered on flexible PET substrates

机译:不同中间层对柔性PET基板上溅射的铟锡氧化物薄膜的影响

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Using radio-frequency magnetron sputtering, various interlayer materials (Cu, Al, Ag, and ZnO) were added to indium-tin oxide (ITO) films on a polyethylene terephthalate (PET) flexible substrate, and were compared to examples made without an interlayer. The effects of the interlayer on the ITO were investigated with X-ray diffractometry (XRD), visible wavelength photospectrometry, four-point probe electrical resistivity, and micro-scratch adhesion tests, which were all conducted at four temperatures (25°C, 35°C, 55°C, and 75°C). The ITO crystallographic texture was overwhelmingly found to be (2 2 2), for all combinations considered. The grain size was reduced in the ITO films having interlayers of Ag or Cu, and was enlarged by the ZnO. The visible light transmittance remained almost unchanged for the Al and ZnO buffers, but Ag and Cu failed to maintain the industry standard of 75-80% for a transparent film. Cu, ZnO, and especially Ag, effectively reduced, whereas, Al increased the sheet resistance of the ITO. Upon heating, the scratch resistance diminished in all cases, excluding Cu, while the sheet resistance grew with respect to temperature, for all films except those with Ag. The XRD intensity and the light transmittance were not significantly affected by temperature.View full textDownload full textKeywordsflexible substrate, indium-tin oxide, interlayer, sputteringRelated var addthis_config = { ui_cobrand: "Taylor & Francis Online", services_compact: "citeulike,netvibes,twitter,technorati,delicious,linkedin,facebook,stumbleupon,digg,google,more", pubid: "ra-4dff56cd6bb1830b" }; Add to shortlist Link Permalink http://dx.doi.org/10.1080/02533839.2011.565613
机译:使用射频磁控溅射,将各种夹层材料(Cu,Al,Ag和ZnO)添加到聚对苯二甲酸乙二醇酯(PET)柔性基板上的铟锡氧化物(ITO)膜中,并与不带夹层的示例进行比较。用X射线衍射法(XRD),可见光波长光谱法,四点探针电阻率和微划痕粘附力试验研究了中间层对ITO的影响,这些试验均在四个温度下(25°C,35°C °C,55°C和75°C)。 ITO晶体学纹理被发现是绝大多数(2×2×2),考虑的所有组合。在具有Ag或Cu的中间层的ITO膜中,晶粒尺寸减小,并且通过ZnO增大。对于Al和ZnO缓冲液,可见光透射率几乎保持不变,但是Ag和Cu未能保持透明膜的行业标准75-80%。 Cu,ZnO,尤其是Ag有效地被还原,而Al增加了ITO的薄层电阻。加热后,除含Ag的所有薄膜外,所有情况下(不包括Cu)的耐划痕性均降低,而薄层电阻随温度的升高而增加。 XRD强度和透光率不受温度影响。查看全文下载全文关键字柔性基板,氧化铟锡,中间层,溅射相关var addthis_config = {ui_cobrand:“ Taylor&Francis Online”,services_compact:“ citeulike,netvibes,twitter ,technorati,可口,linkedin,facebook,stumbleupon,digg,google,更多”,发布号:“ ra-4dff56cd6bb1830b”};添加到候选列表链接永久链接http://dx.doi.org/10.1080/02533839.2011.565613

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