Thermal Conductivity and Thermoelectric Power of Germanium‐Silicon Alloys

摘要

Thermal conductivity measurements have been made on a series of germanium‐silicon alloys. At 300°K for an alloy containing 56 atomic percent Si, the thermal conductivity was found to be six times smaller than the value for pure Ge. Measurements of the thermoelectric power on some alloys are also reported. It is then shown that solid‐solution alloying can significantly increase the figure of merit of thermoelectric materials.