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Measurement of Thermal Conductivity of Electrical Conductors at High Temperatures

机译:高温下导体热导率的测量

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摘要

A new method for measuring the thermal conductivity of electrically conducting materials has been investigated that is particularly well suited for use at high temperatures. The sample has the shape of a narrow bridge between two larger masses of the same substance. The thermal conductivity is derived from the change in resistance which occurs when the narrow bridge is heated by passage of an electric current through it. The small size of the heated region makes it possible to neglect radiation at very high temperatures. It is not necessary to control the exact shape of the bridge, since geometric effects cancel out in the equations used to interpret the heating phenomena. Experimental measurements of the Lorentz ratio and thermal conductivity are reported for single‐crystal molybdenum and tungsten at temperatures up to 1700°K. The application of this method to brittle semiconductor materials is also discussed.
机译:研究了一种测量导电材料导热率的新方法,该方法特别适合在高温下使用。样品在两个较大质量的相同物质之间具有狭窄的桥梁形状。导热率来自于电阻的变化,该电阻的变化是通过电流通过窄桥加热窄桥时发生的。加热区域的小尺寸使得可以忽略非常高温度下的辐射。不必控制桥的确切形状,因为几何效应会在用于解释加热现象的方程式中抵消。报告了在高达1700°K的温度下单晶钼和钨的洛伦兹比和导热率的实验测量值。还讨论了该方法在脆性半导体材料中的应用。

著录项

  • 来源
    《Journal of Applied Physics》 |1963年第6期|共5页
  • 作者

    Cutler M.; Cheney G. T.;

  • 作者单位

    John Jay Hopkins Laboratory for Pure and Applied Science, General Atomic Division, General Dynamics Corporation, San Diego, California;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
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