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The work function of sputter‐formed Re‐1% Pt

机译:溅射形成的Re-1%Pt的功函数

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High‐rate sputter deposition has been used to make free‐standing ribbons of Re‐1% Pt alloy. Changes in the work function and surface composition of the alloy as a function of temperature are reported. Segregation of Pt to the surface was accompanied by a decrease in work function indicating electron transfer from Pt to Re. When the Pt‐to‐Re ratio at the surface reached 0.26, the work function of the alloy was 1.44 eV below that of a pure Re reference ribbon. Analysis of the work function change as a function of surface concentration of Pt on the Topping model yielded values of 7.1×10-30 C m and 19.4 Å3 for the dipole moment and polarizability, respectively, of surface Pt atoms. Electron transfer from Pt to Re is opposite to that expected on the basis of published values of electronegativity and is interpreted as indicating significant exchange of 5d electrons in the alloy.
机译:高速溅射沉积已用于制造Re-1%Pt合金的独立式薄带。报告了合金的功函数和表面组成随温度的变化。 Pt偏析在表面上,同时功函下降,表明电子从Pt转移到Re。当表面的Pt / Re比达到0.26时,合金的功函比纯Re参考带的功函低1.44 eV。在Topping模型上分析功函数随Pt表面浓度变化的函数,得出表面Pt原子的偶极矩和极化率分别为7.1×10-30 C m和19.4Å3。从Pt到Re的电子转移与基于公开的电负性值预期的相反,并且被解释为表明合金中5d电子的大量交换。

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    《Journal of Applied Physics》 |1981年第5期|P.3458-3463|共6页
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  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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