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A holistic approach performance analysis of substrate-free focal plane array

机译:无基板焦平面阵列的整体方法性能分析

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摘要

Based on a bi-material micro-cantilever thermal deformation principle, an uncooled infrared focal plane array (FPA) with optical readout has been developed from a substrate-based structure to a substrate-free structure. Infrared imaging of the substrate-free FPA indicates that this structure does not satisfy temperature-constant substrate conditions when the FPA unit size decreases from 200 μm to 60 μm. To evaluate the performance of the FPA, this paper puts forward an analytical model of heat transfer in the substrate-free FPA, by using a holistic approach and an electrical circuit analogy. The analytical model provides a fast and convenient way to calculate the temperature gray response and the response time of the substrate-free FPA. A substrate-free FPA with a unit size of 50 μm was fabricated. Infrared imaging experiments validate the model and indicate a noise equivalent temperature difference value of 170 mK has been achieved.
机译:基于双材料微悬臂梁热变形原理,具有光学读出功能的未冷却红外焦平面阵列(FPA)已从基于基板的结构发展为无基板的结构。无基板FPA的红外成像表明,当FPA单位尺寸从200μm减小到60μm时,此结构不满足温度恒定的基板条件。为了评估FPA的性能,本文使用整体方法和电路类比,提出了无基材FPA中传热的分析模型。该分析模型提供了一种快速便捷的方法来计算温度灰度响应和无底物FPA的响应时间。制作了单位面积为50μm的无基板FPA。红外成像实验验证了该模型,并表明已达到170 mK的噪声等效温度差值。

著录项

  • 来源
    《Journal of Applied Physics》 |2012年第7期|p.1-9|共9页
  • 作者单位

    CAS Key Laboratory of Mechanical Behavior and Design of Materials, University of Science and Technology of China, Hefei 230027, China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
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