首页> 外文期刊>Journal of Applied Physics >Dynamic space-charge-controlled field emission model of current conduction in metal-insulator-semiconductor capacitors
【24h】

Dynamic space-charge-controlled field emission model of current conduction in metal-insulator-semiconductor capacitors

机译:金属绝缘体 - 半导体电容器电流传导的动态空间电荷控制场发射模型

获取原文
获取原文并翻译 | 示例
获取外文期刊封面目录资料

摘要

A dynamic space-charge-controlled field emission (SCC-FE) model that considers temporal insulator charge variations caused by voltage stress is developed for analyzing the current conduction in insulators in the entire voltage range of measurement, yielding good agreement between experiments and simulations. The usage of prestressed samples in this analysis is essential for accurately estimating the electron affinities of insulators, yielding 1.65 and 1.93 eV as the estimates for A1_2O_3 films formed on GaN by atomic-layer deposition (ALD) at 200 and 450 °C, respectively, and 1.65 and 1.83 eV for those on SiO_2/Si, respectively. Through the bias instability analysis using the method developed here, the voltage-stress tolerance of both Si and GaN metal-insulator-semiconductor (MIS) capacitors with ALD A1_2O_3 films was found to be enhanced by the high-temperature (450 °C) ALD. The analysis also revealed the fact that the voltage-stress-induced flatband voltage shift of GaN capacitors with the high-temperature Al_2O_3 films is mainly caused by the A1_2O_3 charges near the substrate, hence providing a clue to even better bias stability of the GaN capacitors. With possible applications to other wide-bandgap semiconductor (WBGS) capacitors, the dynamic SCC-FE analysis developed here will play an essential role in analyzing not only gate insulator characteristics but also many reliability issues of various WBGS MIS field-effect transistors.
机译:一种动态空间电荷控制的场发射(SCC-FE)模型,其考虑由电压应力引起的时间绝缘体充电变化,用于分析绝缘体中的整个电压测量范围内的电流导通,在实验和模拟之间产生良好的一致性。在该分析中使用预应力样品对于精确地估计绝缘体的电子亲和力,产生1.65和1.93eV作为在GaN上通过200和450℃的原子层沉积(ALD)的A1_2O_3薄膜的估计,对于SiO_2 / Si的那些,分别为1.65和1.83eV。通过使用此处开发的方法的偏置不稳定性分析,发现具有ALD A1_2O_3薄膜的Si和GaN金属 - 绝缘体 - 半导体(MIS)电容器的耐压容差被高温(450℃)ALD增强。分析还揭示了GaN电容器具有高温Al_2O_3膜的电压引起的电压电压移位主要由基板附近的A1_2O_3电荷引起的,因此提供了用于更好地偏置GaN电容器的线索。对于其他宽带隙半导体(WBG)电容器的可能应用,这里开发的动态SCC-FE分析将在分析栅极绝缘体特征方面的基本作用中发挥重要作用,而且在各种WBGS MIS场效应晶体管的许多可靠性问题中起着重要作用。

著录项

  • 来源
    《Journal of Applied Physics》 |2020年第6期|065307.1-065307.17|共17页
  • 作者单位

    Research Organization for Nano and Life Innovation Waseda University 513 Waseda-tsurumaki Shinjuku Tokyo 162-0041 Japan Institute of Materials and Systems for Sustainability (Tokyo Branch) Nagoya University Bldg. 120-5 (Waseda University) 513 Waseda-tsurumaki Shinjuku Tokyo 162-0041 Japan;

    Faculty of Science and Engineering Waseda University 3-4-1 Okubo Shinjuku Tokyo 169-8555 Japan;

    Research Organization for Nano and Life Innovation Waseda University 513 Waseda-tsurumaki Shinjuku Tokyo 162-0041 Japan Faculty of Science and Engineering Waseda University 3-4-1 Okubo Shinjuku Tokyo 169-8555 Japan The Kagami Memorial Laboratory for Materials Science and Technology Waseda University 2-8-26 Nishiwaseda Shinjuku Tokyo 169-0051 Japan;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号