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首页> 外文期刊>Journal of Applied Physics >Effect of thermal annealing on thermoelectric properties of Bi_xSb_(2-x)Te_3 thin films grown by sputtering
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Effect of thermal annealing on thermoelectric properties of Bi_xSb_(2-x)Te_3 thin films grown by sputtering

机译:热退火对通过溅射生长的Bi_XSB_(2-X)TE_3薄膜热电性能的影响

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摘要

The present study focuses on the enhancement of the Seebeck coefficient (S) of BiSbTe alloy thin films on post-deposition annealing. It is demonstrated that thermal treatment leads to about twofold enhancement in the S of BiSbTe alloy thin films deposited using DC magnetron sputtering. Investigation of the enhanced thermoelectric properties has been done by studying their phase, compositional, and structural properties. The x-ray diffraction patterns show the presence of a mixed Bi_xSb_(2-x)Te_3 phase, which crystallizes in the Sb-rich phase on annealing. The surface morphology of the as-deposited samples exhibit spherical features that grow in the form of hexagonal rods on increasing the annealing temperature to 300 °C. However, on further increasing the annealing time to 3 h at 300 °C, distorted cubical micro-structures were observed. The microstructures had a higher Sb/Bi ratio, implying that these structures were Sb rich. The thermoelectric properties of the nanostructured Bi_xSb_(2- x)Te_3 films were studied as a function of annealing temperature and time. An enhancement of about two orders of magnitude is observed both in the S and power factor for the samples annealed at 300 °C for 3 h. This enhancement is attributed to the energy filtering of charge carriers at the junction of the Bi_xSb_(2-x)Te_3 matrix and Sb-rich inclusions. These results indicate that annealing is an efficient way of tuning the growth of microstructures and the S of Bi_xSb_(2-x)Te_3 thin films.
机译:本研究侧重于在沉积后退火上提高BISBTE合金薄膜的塞贝克系数。结果表明,使用DC磁控溅射沉积的BISBTE合金薄膜S中的热处理导致大约两倍增强。通过研究它们的相,组成和结构性能来研究增强的热电性能。 X射线衍射图案显示出混合Bi_XSB_(2-x)TE_3相的存在,其在退火的SB富含的相位中结晶。沉积样品的表面形态表现出球形特征,其以六边形棒的形式生长,以增加退火温度至300℃。然而,在进一步将退火时间进一步增加到3小时,观察到扭曲的立方体微结构。微观结构具有更高的Sb / Bi比,暗示这些结构是Sb富含的。作为退火温度和时间的函数研究了纳米结构的Bi_SB_(2-X)TE_3膜的热电性能。在300℃下退火3小时的样品中的S和功率因数,在S和功率因数中观察到大约两个数量级的增强。这种增强归因于Bi_XSB_(2-X)TE_3矩阵和富含SB的夹杂物的结处的电荷载波的能量滤波。这些结果表明退火是调整微结构和Bi_XSB_(2-X)TE_3薄膜的微观结构和S的生长的有效方式。

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  • 来源
    《Journal of Applied Physics 》 |2020年第24期| 245108.1-245108.12| 共12页
  • 作者单位

    Department of Physics and Astrophysics University of Delhi New Delhi 110007 India;

    Inter-University Accelerator Centre Aruna Asaf Ali Marg New Delhi 110067 India Department of Physics Jamia Millia Islamia University New Delhi 110025 India;

    Department of Physics and Astrophysics University of Delhi New Delhi 110007 India;

    Inter-University Accelerator Centre Aruna Asaf Ali Marg New Delhi 110067 India;

    Inter-University Accelerator Centre Aruna Asaf Ali Marg New Delhi 110067 India;

    Department of Physics and Astrophysics University of Delhi New Delhi 110007 India;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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  • 正文语种 eng
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