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CMOS-embedded high-power handling RF-MEMS tunable capacitor using quadruple series capacitor and slit with dielectric bridges structure

机译:使用四重串联电容器和带有介电桥结构的缝隙的CMOS嵌入式大功率处理RF-MEMS可调电容器

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摘要

In this paper, we report on a high-power handling RF-MEMS tunable capacitor that has a quadruple series capacitor ( QSC) and a movable electrode using a slit with dielectric bridges (SDB) structure. The QSC structure consists of two fixed metal-insulator-metal (MIM) capacitors and two MEMS capacitor elements connected in series, and enables reduction of the RF voltage to the MEMS capacitors. The SDB structure is able to increase the release voltage without increasing the pull-in voltage. The combination of these structures enables improving power handling capabilities. A capacitor bank using QSC and SDB structures was fabricated by a micromachining process above CMOS control circuits. Measurement results demonstrate the excellent power handling capability up to +44 dBm for cold switching, and up to +35dBm under hot switching. Moreover, the Q-factor of the capacitor bank is very high that is above 150 at 1 GHz, and the capacitance can be changed from 1.1 to 5.3 pF at a resolution of 4 bits by the internal control circuits thanks to monolithic integration. (c) 2018 The Japan Society of Applied Physics.
机译:在本文中,我们报告了一种高功率处理RF-MEMS可调电容器,该电容器具有四重串联电容器(QSC)和可动电极,该电极使用带有电介质桥(SDB)的缝隙。 QSC结构由两个固定的金属-绝缘体-金属(MIM)电容器和两个串联的MEMS电容器元件组成,可以降低MEMS电容器的RF电压。 SDB结构能够在不增加引入电压的情况下增加释放电压。这些结构的组合可提高功率处理能力。使用QSC和SDB结构的电容器组是通过在CMOS控制电路之上的微加工工艺制造的。测量结果表明,出色的功率处理能力在冷切换时高达+44 dBm,在热切换时高达+ 35dBm。此外,电容器组的Q因子非常高,在1 GHz时超过150,并且由于采用了单片集成,内部控制电路可以以4位分辨率将电容从1.1 pF更改为5.3 pF。 (c)2018年日本应用物理学会。

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