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Surface Electrical Conduction measurement of Si (100) film of Silicon-on-Insulator wafers

机译:绝缘体上硅晶片的Si(100)膜的表面电导测量

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This paper discusses an investigation into the surface electrical conduction of Si(100) film in the Silicon-on-Insulator (SOI) wafer. Controlling the gate voltage of the so-called 'pseudo-MOSFET', which is a kind of MOSFET and in which the gate voltage is applied to the substrate of SOI wafers, can reduce the contribution from conduction inside the silicon film. The drain current and the resistivity of the silicon film were measured at the cut-off region in drain current-gate voltage (I_d-V_g) characteristics of the pseudo-MOSFET. The experiment shows that the drain current at this region of the HF-treated sample becomes much higher than that of one before HF treatment. Compared with a calculated approximation, this high drain current cannot be explained by the existence of the inversion layer caused by the pinning at the silicon film surface. Hence, it must be due to the surface electrical conduction.
机译:本文讨论对绝缘体上硅(SOI)晶片中Si(100)膜的表面导电性的研究。控制所谓的“伪MOSFET”的栅极电压是一种MOSFET,其中将栅极电压施加到SOI晶片的衬底上,可以减少来自硅膜内部导电的影响。在伪MOSFET的漏极电流-栅极电压(I_d-V_g)特性的截止区域中测量硅膜的漏极电流和电阻率。实验表明,经过HF处理的样品的该区域的漏极电流变得比HF处理之前的漏极电流高得多。与计算出的近似值相比,无法通过由硅膜表面的钉扎引起的反型层的存在来解释这种高漏极电流。因此,这必须归因于表面导电。

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