首页> 外文期刊>Japanese Journal of Applied Physics. Part 1, Regular Papers & Short Notes >Process Integration Issues on Mo-Metal-Gated MOSFETs with HfO_2 High-k Gate Dielectrics
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Process Integration Issues on Mo-Metal-Gated MOSFETs with HfO_2 High-k Gate Dielectrics

机译:具有HfO_2高k栅极电介质的Mo-金属门控MOSFET的工艺集成问题

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摘要

We investigate a MoN_x/HfO_2 gate stack fabricated using a gate-first process flow. We ideally etch the MoN_x/HfO_2 gate stack using a Cl_2-O_2 gas system. The work function variation of MoN_x gates is more than 0.7 eV. The work function can extensively cover the energy of the band gap of Si except that near the conduction band. In addition, we show issues on thermal budget from N diffusion in Mo and the reaction of Mo with HfO_2. We propose that thin-SiN insertion between MoN_x and HfO_2, and a decrease in Mo thickness are useful in fabricating process windows. On the basis of the results, we fabricate metal-oxide -semiconductor (MOS) devices and show their excellent characteristics.
机译:我们调查使用栅极优先工艺流程制造的MoN_x / HfO_2栅极堆叠。我们理想地使用Cl_2-O_2气体系统蚀刻MoN_x / HfO_2栅堆叠。 MoN_x门的功函数变化大于0.7 eV。功函数可以广泛地覆盖Si的带隙能量,除了导带附近。另外,我们还显示了由于氮在Mo中的扩散以及Mo与HfO_2的反应而引起的热收支问题。我们认为,在MoN_x和HfO_2之间插入薄SiN以及减小Mo厚度可用于制造工艺窗口。根据结果​​,我们制造了金属氧化物半导体(MOS)器件,并展示了它们的优异特性。

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