Excess Carrier Lifetime Measurement of Bulk SiC Wafers and Its Relationship with Structural Defect Distribution

摘要

Excess carrier lifetime in bulk 2-in. SiC wafers was measured by microwave photoconductivity decay (μ-PCD). The mapping technique was used to obtain the lifetime distribution in the entire wafer. We observed the birefringence image and X-ray topograph of the wafers in order to determine the structural defect distribution, and the net donor concentration distribution was also observed by capacitance-voltage measurements. By comparison of lifetime maps with the structural defect distribution, it was found that relatively long lifetime regions correspond to regions with high-density structural defects. The net donor concentration did not show a clear influence on the carrier lifetimes. We confirmed that surface recombination has a negligible effect on the carrier lifetimes, and therefore the lifetimes obtained from mapping measurements are mainly dominated by carrier recombination behavior in the bulk of the wafers.