Development of Multibeam Electron Beam Direct Writing System Using Third-Order Imaging Technique

摘要

We report the development of a new electron beam direct writing (EBDW) system embodying a concept that can realize both high throughput and fine resolution. The equipment has a multicolumn system with the third-order imaging technology, which obtains steep edge acuity with high current density as compared with conventional shaped beam methods. We attempt to apply this to via/contact layers, for which it is difficult to obtain resist patterns using any optical lithography systems. We also showed proof of concept of third-order imaging serving as a technique for simultaneously satisfying improvement in current density without beam blur and forming a beam to a desired shape. The advantage of the third-order imaging technique is a potential solution that may break through the technological impasse of high current density versus high resolution. We are currently engaged in enhancing the high-acceleration-energy and multicolumn system and in its development for mass production.