Direct Writing of Resist Patterns Using a Wire Nozzle Newly Developed for an Air-Pressure Dispenser

摘要

Direct writing of resist patterns using an air-pressure dispenser is expected as a low-cost patterning method for fabricating various microdevices. However, it was difficult to smoothly delineate fine resist patterns with a width of less than 100 μm when a commercial air-pressure dispenser system was used, because high-viscosity resists block fine dispenser nozzles, and low-viscosity resists spread after they are dispensed. For this reason, a new wire-nozzle dispenser was developed to write fine resist patterns with a width of less than 100 μm. The technology is especially suitable for customized small-scale productions. In the experiments, patterns were delineated onto wafers and copper-clad plastic substrates using the new wire-nozzle dispenser with an inner diameter of 100μm and a wire diameter of 30 μm. As a result, straight line patterns with a minimum width of 50 μm were successfully delineated using a resist PMER P-LA900PM with a viscosity of 1500mPa-s. Patterns circularly curved with a radius of 1 mm and a width of 130nm were also smoothly delineated. In addition, microreactor patterns including a joint point and curved shapes were successfully written. Although the linewidths at the curved parts slightly differed from those at the straight parts, all the patterns were smoothly stitched. Moreover, complicated patterns with variously curved routes were also successfully delineated. It was verified that the newly developed wire nozzle was useful as a new dispenser tool.