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Improvement of Yield Strength-Transition Temperature Balance by Microstructural Refinement

机译:通过微细化改善屈服强度-转变温度的平衡

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Grain-refinement simultaneously increases yield strength and toughness while the strengthening without the grain-refinement still deteriorates the toughness. It is worth assessing how the strengthening relates to the toughness to strengthen steels most appropriately. In this study, different mechanisms for strengthening are compared with respect to the relationship between yield strength and ductile-brittle fracture transition temperature. Considered are the grain-refinement by solute copper or thermo-mechanical control process (TMCP), the precipitation-hardening by copper, and the bainite-transformation hardening with alloying elements such as boron, molybdenum, and nickel. The transition temperature rises with strengthening by the precipitation-hardening and the transformation-hardening. In this case, the relationship is approximately linear with the gradient of 0.46℃/MPa. In contrast, the transition temperature lowers in the case of the strengthening by the grain-refinement achieved by the solute copper and the TMCP. This study aims at relating the yield strength to the transition temperature on a dislocation crack model of brittle fracture. Considering the energy balance for brittle crack initiation and the temperature dependence of the friction stress for the Hall-Petch relationship gives the linear lowering of transition temperature with increasing yield strength by grain-refinement, of which gradient is estimated at approximately 0.80℃/MPa. The comparison of experimental results with this relationship indicates that the strengthening by solute copper effectively utilizes the grain-refinement.
机译:晶粒细化同时提高了屈服强度和韧性,而没有晶粒细化的强化仍使韧性劣化。值得评估的是,强化与韧性如何最合适地强化了。在这项研究中,就屈服强度与韧性-脆性断裂转变温度之间的关系而言,比较了不同的强化机制。考虑的是通过溶质铜或热机械控制工艺(TMCP)进行的晶粒细化,通过铜进行的沉淀硬化以及通过合金元素(如硼,钼和镍)进行的贝氏体转变硬化。通过沉淀硬化和相变硬化的强化,转变温度升高。在这种情况下,该关系近似线性,梯度为0.46℃/ MPa。相反,在通过固溶铜和TMCP实现的晶粒细化来增强的情况下,转变温度降低。本研究旨在在脆性断裂的位错裂纹模型上将屈服强度与转变温度联系起来。考虑到脆性裂纹萌生的能量平衡以及霍尔应力与摩擦应力的温度相关性,Hall-Petch关系可通过晶粒细化使转变温度随屈服强度的增加而线性降低,其梯度估计约为0.80℃/ MPa。与该关系的实验结果的比较表明,固溶铜的强化有效地利用了晶粒细化。

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