Flip-Chip Assembly Design of an Electro-Absorption Modulated Laser Based on EM/Circuit Comodeling

摘要

We designed two kinds of flip-chip bonded electro-absorption modulated laser on A1N or Si carrier, working at 100 Gb s~(-1). A theoretical comodeling approach based on 3D electromagnetic and circuit simulations has been applied and validated by measurements. As demonstrated, integration and behavior of future complex opto-electronic modules could be optimized applying such EM-based approach.