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The electronic structure and bonding of an hydrogen pair near a FCC Fe stacking fault

机译:FCC Fe堆垛层错附近氢对的电子结构和键合

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The bonding of H to Fe is analyzed using qualitative electronic calculations in the framework of the atom superposition and electron delocalization orbital cluster method (ASED-MO). Upon introduction of a stacking fault in FCC Fe, the changes in the electronic structure are studied when a pair of hydrogen atoms are located near the fault. A cluster of 180 metallic atoms distributed in five layers represents the solid. The interstitial H atoms are positioned in accordance with previous studies. The Fe-H interaction decreases the Fe-Fe bond strength and the H effect is limited to the first Fe neighbor.
机译:在原子叠加和电子离域轨道簇方法(ASED-MO)的框架内,使用定性电子计算分析了H与Fe的键合。在FCC Fe中引入堆垛层错后,研究了当一对氢原子位于断层附近时电子结构的变化。分布在五层中的180个金属原子簇代表固体。间隙H原子的定位与以前的研究一致。 Fe-H相互作用降低了Fe-Fe键的强度,并且H效应仅限于第一个Fe邻域。

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