机译:具有垂直和水平晶圆排列的瞬态多晶圆批处理原子层沉积工艺的实验和数值研究
Department of Mechanical Engineering, University of Wisconsin-Milwaukee, Milwaukee, WI 53201, USA;
Department of Mechanical Engineering, University of Wisconsin-Milwaukee, Milwaukee, WI 53201, USA;
Department of Mechanical Engineering, University of Wisconsin-Milwaukee, Milwaukee, WI 53201, USA;
Department of Mechanical Engineering, University of Wisconsin-Milwaukee, Milwaukee, WI 53201, USA;
Department of Mechanical Engineering, University of Wisconsin-Milwaukee, Milwaukee, WI 53201, USA ,School of Engineering, University of Alaska Anchorage, Anchorage, AK 99508, USA;
Department of Mechanical Engineering, University of Wisconsin-Milwaukee, Milwaukee, WI 53201, USA;
Atomic layer deposition; Multi-wafer batch ALD; Alumina ALD; Experimental investigation; Simulations;
机译:商业化多晶圆氢化物气相外延在6英寸晶圆上生长的氮化镓薄膜层的数值模拟
机译:离子轰击在氧化硅(SiO_2)血浆增强原子层沉积(PEALD)过程中的实验和数值分析
机译:可持续制造纳米薄膜的原子层沉积过程建模与实验研究
机译:垂直多晶圆CVD系统中SIC的外延生长:已经适合生产工艺吗?
机译:航天器应用原子层沉积工艺的实验与图形理论研究
机译:通过批量原子层沉积处理的基于HfO2的集成式1晶体管1电阻阻性随机存取存储器的材料见解
机译:单晶圆原子层沉积过程的数值模拟