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Temperature-gradient-aware bionic optimization method for heat source distribution in heat conduction

机译:导热中热源分布的温度梯度仿生优化方法

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Heat source distribution optimization is a fundamental problem for electronic cooling, which influences the performance and the life of the electronics. In this paper, the temperature-gradient-aware bionic optimization (TGBO) is developed for heat source distribution problem in heat conduction. Mathematical analysis is conducted to figure out the influence of the added heat source on the temperature gradient field. Based on the analyzed result, the placement strategy of the heat sources is proposed for bionic optimization, which suggests the added heat source be located at the position with the maximum magnitude of temperature gradient. Three typical numerical cases are used to validate the effectiveness of the proposed optimization method and to compare the solutions with the ones of the temperature-aware bionic optimization (TBO) in previous study. The optimized results indicate that TBO is likely to arrange the heat sources with some certain distances among each other and is more suitable for the problems with relatively symmetric boundary conditions. While for TGBO, the final solutions are likely to locate the heat sources adjacent to each other. TGBO performs better for the problems with asymmetric boundary conditions. Moreover, the total calculation of TGBO is less than the one of TBO in general, especially for the cases with symmetric boundary conditions. The influence of the initial position of the first heat source on the performance of bionic optimization method is also investigated. The results show that the first heat source is better to be placed at the position with the best heat transfer condition, which can help to improve the performance of the final solution and reduce the number of the steps during the adjusting stage. It is suggested that temperature-gradient-aware bionic optimizations is an effective method to optimize the heat source distribution for heat conduction enhancement.
机译:热源分配优化是电子冷却的基本问题,它影响电子设备的性能和寿命。本文针对热传导中的热源分布问题,开发了温度梯度仿生优化算法(TGBO)。进行数学分析以找出添加的热源对温度梯度场的影响。在分析结果的基础上,提出了仿生优化的热源布置策略,表明所添加的热源位于温度梯度最大的位置。使用三个典型的数值案例来验证所提出的优化方法的有效性,并将解决方案与先前研究中的温度感知仿生优化(TBO)进行比较。优化结果表明,TBO可能将热源彼此之间以一定的距离排列,并且更适合边界条件相对对称的问题。对于TGBO,最终解决方案可能是将热源彼此相邻放置。 TGBO在边界条件不对称的情况下表现更好。而且,TGBO的总计算量通常小于TBO的计算量,尤其是对于对称边界条件的情况。还研究了第一热源的初始位置对仿生优化方法性能的影响。结果表明,最好将第一热源放置在传热条件最好的位置,这有助于提高最终解决方案的性能,减少调整阶段的步骤数。提出了温度梯度感知的仿生优化方法是一种优化热源分布以增强热传导的有效方法。

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