机译:具有梯度分布阵列的液冷综合微铅翅片芯片的传热特性调查以及芯片微流体冷却的双加热输入
Key Laboratory of Low-grade Energy Utilization Technologies and Systems Chongqing University Ministry of Education Chongqing 400030 China School of Energy and Power Engineering Chongqing University Chongqing 400030 China;
Key Laboratory of Low-grade Energy Utilization Technologies and Systems Chongqing University Ministry of Education Chongqing 400030 China School of Energy and Power Engineering Chongqing University Chongqing 400030 China;
Key Laboratory of Low-grade Energy Utilization Technologies and Systems Chongqing University Ministry of Education Chongqing 400030 China School of Energy and Power Engineering Chongqing University Chongqing 400030 China;
Key Laboratory of Low-grade Energy Utilization Technologies and Systems Chongqing University Ministry of Education Chongqing 400030 China School of Energy and Power Engineering Chongqing University Chongqing 400030 China;
Key Laboratory of Low-grade Energy Utilization Technologies and Systems Chongqing University Ministry of Education Chongqing 400030 China School of Energy and Power Engineering Chongqing University Chongqing 400030 China;
Intra-Chip micro-fluidic cooling; Embedded gradient distribution; Working conditions; Chip temperature uniformity; Heat transfer enhancement;
机译:转载:使用电介质冷却剂进行嵌入式梯度分布微引脚翅片阵列的温度均匀性增强和流量特性
机译:用于液冷芯片的超薄歧管微通道散热器的实验研究
机译:具有微流体冷却和焦耳热效应的3D集成系统的电热联合仿真
机译:层间冷却芯片堆叠非均匀散热腔中针鳍阵列的攻角研究
机译:在(110)硅基板中蚀刻的深矩形液体冷却微通道中的传热和流体流动。
机译:带有不同形状肋的微流控散热器的热传递和摩擦特性
机译:具有微流体冷却和焦耳热效应的三维集成系统的电 - 热联合仿真