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True front-to-back analogue IC designers' training

机译:真正的前后模拟IC设计师培训

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摘要

Analogue and mixed-signal sensor electronics comprise a small yet essential fraction of a large variety of embedded and integrated systems in industrial application systems. While the number of devices is considerably smaller than in massively parallel digital systems, the design of each device requires much more care, time and experience; moreover, learning the skills required for analogue and mixed-signal sensor electronics can be tedious, and these challenges are not taken up by a sufficient number of students to meet industry demands, in particular of the booming sensor and microelectromechanical systems industries. To attract more students to this topic, we offer design courses that combine theoretical and practical skills based on state-of-the-art tools and technologies. Students undertake (individually or in small groups) analogue/mixed signal design projects, but, due to the time constraints common in engineering courses, they are often unable to test to their designs. Drawing from research work and results on dynamically reconfigurable sensor electronics, we have tackled this problem by giving students an opportunity to download their dimensioning solution into certain reconfigurable devices and to carry out testing and measurement to characterise their designs. To this end, we introduced the true front-to-back (TFB) analogue IC designers training kit, used in the CAD laboratory at the Institute of Integrated Sensor Systems (ISE) in TU-Kaiserslautern for various engineering curricula. This paper gives the details of the teaching concepts and state of implementation, the reconfigurable hardware platform and typical results for student design and measurement activities. Finally, we give an outlook on upcoming reconfigurable chips. [PUBLICATION ABSTRACT]
机译:模拟和混合信号传感器电子产品在工业应用系统中的各种嵌入式和集成系统中只占很小的一部分,但占绝对重要的比例。尽管设备的数量比大规模并行数字系统要少得多,但是每个设备的设计都需要更多的照顾,时间和经验。此外,学习模拟和混合信号传感器电子设备所需的技能可能是乏味的,并且这些挑战没有被足够多的学生来满足,尤其是蓬勃发展的传感器和微机电系统行业的行业需求。为了吸引更多的学生学习这一主题,我们提供了设计课程,这些课程结合了基于最新工具和技术的理论和实践技能。学生从事(单独或小组)模拟/混合信号设计项目,但是由于工程课程中常见的时间限制,他们通常无法测试其设计。通过研究和动态可重配置传感器电子产品的研究成果,我们为学生提供了将他们的尺寸标注解决方案下载到某些可重配置设备中并进行测试和测量以表征其设计的机会,从而解决了这个问题。为此,我们介绍了真正的前后(TFB)模拟IC设计人员培训套件,该套件在TU-Kaiserslautern的集成传感器系统研究所(ISE)的CAD实验室中用于各种工程课程。本文详细介绍了教学概念和实施状态,可重新配置的硬件平台以及学生设计和测量活动的典型结果。最后,我们对即将到来的可重构芯片进行了展望。 [出版物摘要]

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    Senthil Kumar Lakshmanan and Andreas KönigInstitute of Integrated Sensor Systems, Department of Electrical and Computer Engineering, TU-Kaiserslautern, Kaiserslautern, GermanyE-mail: koenig@eit.uni-kl.de;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
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  • 入库时间 2022-08-17 23:19:08

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