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Interconnecting drivers to flexible displays

机译:将驱动程序互连到柔性显示器

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Several options to interconnect driver chips to a flexible display are discussed and investigated. In the first option, bare test dies are flip-chip (FC) assembled onto polyethylene terephthalate (PET) display substrates. The second option involves test flexible polyimide (PI) substrates, imitating tape-carrier-packaged drivers (TCP), bonded onto the same PET substrates, whereas the third option uses actual TCPs on stainless-steel display substrates. Each option makes use of bonding technology with anisotropically conductive adhesive, supplied as film (ACF). The reason for using ACF is that drivers typically have high output counts, and therefore very fine pad features, 200-um pitch and below. The technology has been adapted for each option, considering the requirements of the substrate. Every option includes an explanation of the bond test setup, the bonding process itself, and a discussion of the test results. The conclusion summarizes the achievements made in the research reported in this article.
机译:讨论和研究了将驱动器芯片互连到柔性显示器的几种方法。在第一种选择中,将裸露的测试芯片倒装芯片(FC)组装到聚对苯二甲酸乙二醇酯(PET)显示器基板上。第二种选择涉及测试柔性聚酰亚胺(PI)基材,模仿粘合在同一PET基材上的带状载体包装的驱动器(TCP),而第三种选择则使用不锈钢显示基材上的实际TCP。每个选项都使用各向异性导电粘合剂的粘合技术,该粘合剂以薄膜(ACF)的形式提供。使用ACF的原因是驱动器通常具有较高的输出计数,因此具有非常精细的焊盘功能(200μm及以下)。考虑到基板的要求,该技术已针对每种选择进行了修改。每个选项都包括对键合测试设置的说明,键合过程本身以及对测试结果的讨论。结论总结了本文报道的研究成果。

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