Winning JSID Outstanding Student Paper Describes Solution-Processed Metal Oxide on Flexible Foil

摘要

The current flat-panel active-matrix organic light-emitting-diode (AMOLED) display market is dominated by low-temperature poly-silicon (LTPS) backplane technology on rigid glass plates. LTPS as a backplane for larger display sizes, such as TVs, has some drawbacks. The excimer laser used for LTPS does not scale to larger sizes. LTPS is fairly costly to implement and also requires relatively high processing temperatures (＞300℃). These temperatures limit the integration of LTPS directly onto desirable, lighter weight substrates such as flexible foil or plastic, which degrade in high heat.