机译:SiC MOSFET的压装包装解决方案
College of Electrical Engineering, Zhejiang University, Hangzhou, China;
Department of Electrical Engineering, University of Arkansas, Fayetteville, AR, USA;
College of Electrical Engineering, Zhejiang University, Hangzhou, China;
College of Electrical Engineering, Zhejiang University, Hangzhou, China;
Department of Electrical Engineering, University of Arkansas, Fayetteville, AR, USA;
Packaging; press-pack; SiC MOSFET; stray inductance; thermal management;
机译:SiC功率模块封装应用中压装结构的热力学分析和表征
机译:扇出面板级PCB嵌入式SIC电源MOSFET包装
机译:低电感功率模块封装中的SiC沟道MOSFET的特性
机译:短路条件下SiC MOSFET压装和焊线技术的比较
机译:6H-αSiC的热氧化电钝化及其表征和在SiC MOSFET中的应用。
机译:负栅偏置SiC MOSFET的辐射响应
机译:在打包SiC MOSFET中的开关模式操作期间VTH和RON漂移的评估