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Circuit Performance Degradation of Switched-Capacitor Circuit with Bootstrapped Technique due to Gate-Oxide Overstress in a 130-nm CMOS Process

机译:在130nm CMOS工艺中由于栅极氧化物过应力而导致的自举技术导致开关电容器电路的电路性能下降

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摘要

The MOS switch with bootstrapped technique is widely used in low-voltage switched-capacitor circuit. The switched-capacitor circuit with the bootstrapped technique could be a dangerous design approach in the nano-scale CMOS process due to the gate-oxide transient overstress. The impact of gate-oxide transient overstress on MOS switch in switched-capacitor circuit is investigated in this work with the sample-and-hold amplifier (SHA) in a 130-nm CMOS process. After overstress on the MOS switch of SHA with unity-gain buffer, the circuit performances in time domain and frequency domain are measured to verify the impact of gate-oxide reliability on circuit performances. The oxide breakdown on switch device degrades the circuit performance of bootstrapped switch technique.
机译:具有自举技术的MOS开关广泛用于低压开关电容器电路中。由于栅极氧化物瞬态过应力,采用自举技术的开关电容器电路在纳米级CMOS工艺中可能是危险的设计方法。在这项工作中,采用130nm CMOS工艺的采样保持放大器(SHA),研究了栅极氧化物瞬态过应力对开关电容器电路中MOS开关的影响。在使用单位增益缓冲器对SHA的MOS开关施加过大应力之后,测量时域和频域的电路性能,以验证栅极氧化物可靠性对电路性能的影响。开关器件上的氧化物击穿会降低自举开关技术的电路性能。

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