Design analysis of novel coupling structures for multilayer MMIC's

摘要

Novel monolithic multilayered coupling structures are presented, and their performances are analyzed. These structures have reduced current crowding at their conductor edges compared to coplanar-type coupling structures, and are particularly suitable for integration with multidielectric MMICs. The closed-form analytical expressions for the coupler's even and odd mode impedances and coupling coefficients derived using conformal mapping techniques are presented. These direct formulas have the advantage of being well suited for the computer aided design analysis of MMICs without the need for lengthy numerical modeling techniques.